Supermicro SYS-112D-36C-FN3P Edge Infrastructure Server

High-Density Edge Computing Platform

The Supermicro SYS-112D-36C-FN3P is a powerful 1U edge infrastructure server designed for telecommunications, network virtualisation, edge AI, software-defined networking and distributed enterprise deployments. Powered by Intel® Xeon® D processors, the platform combines compute, networking and expansion capabilities within a compact edge-ready architecture.

Intel® Xeon® D Platform

Enterprise-grade processing designed for demanding edge infrastructure, networking and virtualisation workloads.

Network Edge Ready

High-density networking enables deployment of edge services, telecom applications and distributed infrastructure.

PCIe Expansion

Supports accelerator, networking and storage expansion options for specialised edge deployments.

Compact 1U Design

Optimised for space-constrained edge locations, communications cabinets and distributed infrastructure environments.

Ideal Applications

  • Edge Computing Infrastructure
  • Telecommunications Networks
  • 5G Deployments
  • Network Function Virtualisation (NFV)
  • Software Defined Networking (SDN)
  • Edge AI Applications
  • Security & Surveillance Infrastructure
  • Industrial Networking
  • Private Edge Cloud
  • Distributed Enterprise Computing

Platform Highlights

Architecture 1U Edge Infrastructure Server
Processor Intel® Xeon® D Platform
Networking Integrated High-Speed Network Connectivity
Expansion PCIe Expansion Support
Deployment Edge, Telecom and Enterprise Infrastructure
Form Factor Compact 1U Rackmount

Built for Distributed Enterprise Infrastructure

The SYS-112D-36C-FN3P delivers enterprise-grade compute, networking and reliability in a compact platform designed for modern edge deployments where performance, connectivity and space efficiency are critical.

Price available upon request.

Product Specifications

Product SKUs
SYS-112D-36C-FN3P Edge Infrastructure Server
Motherboard
Super X14SDV-36C-SP3F
Processor
CPU Intel® Xeon® 6 SoC
Note Supports up to 235W TDP CPUs (Air Cooled)
GPU
Maximum GPU Count Up to 1 Double-Width or 1 Single-Width GPU
Supported GPU Intel Arc™ Pro B50 Graphics, Arc™ Pro B60 Graphics (DW), Arc™ Pro B60 Graphics (SW)
CPU-GPU Interconnect PCIe 5.0 x16 CPU-to-GPU Interconnect
System Memory
Memory 4 DIMM Slots / 1 Channel
Up to 512GB 6400MT/s ECC DDR5 RDIMM
Memory Voltage 1.1V
On-Board Devices
Network Connectivity 1 RJ45 1GbE with Intel® I210-IT
2 QSFP28 100GbE with Intel® SoC
Input / Output
LAN 1 RJ45 1GbE LAN Port (Intel® I210-IT)
2 QSFP28 100GbE LAN Ports (Intel® SoC)
IPMI Shared on LAN Port 1
USB 2 USB 2.0 Ports (Header)
2 USB 3.0 Type-A Ports (Front)
Video 1 VGA Port
Serial 1 COM Port (Header)
TPM 1 TPM Header
System BIOS
BIOS Type AMI 64MB UEFI
BIOS Features ACPI 6.5
SMBIOS 3.7 or Later
UEFI 2.9
PCI F/W 3.3
Plug and Play (PnP)
Management
Software SuperCloud Composer®
Supermicro Server Manager (SSM)
Super Diagnostics Offline (SDO)
Supermicro Thin-Agent Service (TAS)
SuperServer Automation Assistant (SAA)
Plug-ins for 3rd Party Software
Power Configurations Power-On Mode for AC Power Recovery
ACPI Power Management
Security
Hardware Trusted Platform Module (TPM) 2.0
Features Cryptographically Signed Firmware
Secure Boot
Secure Firmware Updates
Automatic Firmware Recovery
System Lockdown
PC Health Monitoring
CPU Monitors CPU Cores, Chipset Voltages and Memory
Fan Tachometer Monitoring, PWM Fan Connectors and Speed Control
Temperature CPU Thermal Trip Support and Chassis Environment Monitoring
Voltage Monitors CPU Core Voltages, +3.3V, +12V, +3.3Vstb, +5Vstb, Vcore and Vmem
Other Features Wake-on-LAN, RoHS, Power Recovery from AC Power Loss and ACPI Power Management
Chassis
Form Factor 1U Rackmount
Model CSE-515M-R000NDFP2
Dimensions and Weight
Height 1.7" (43.18 mm)
Width 17.2" (437 mm)
Depth 15.7" (399 mm)
Package 8" (H) x 27" (W) x 24" (D)
Weight Gross Weight: 19.27 lbs (8.74 kg)
Net Weight: 16.53 lbs (7.5 kg)
Available Colour Black Front & Silver Body
Front Panel
Buttons Power On/Off
UID Button
LED HDD Activity
LAN1 Activity
LAN2 Activity
Power Status
System Information
Expansion Slots
PCIe Configuration 1 PCIe 5.0 x16 FHFL Slot
Drive Bays / Storage
Drive Bays 2 Internal Fixed 2.5" PCIe 4.0 x4 NVMe Drive Bays
M.2 1 M.2 PCIe 4.0 x4 NVMe Slot (M-Key 2280)
System Cooling
Fans Up to 5 Counter-Rotating Hot-Swappable 40x40x56mm Fans
Air Shroud 1 Air Shroud
Power Supply
2x 800W Redundant (1+1) Platinum Level (94%) Power Supplies
Dimension (W x H x L) 54.5 x 40.25 x 220 mm
Input 100-127Vac
200-240Vac
230-240Vdc
+12V Up to 66.6A Output
5V SB Max 4A
Output Type Backplanes (Gold Finger)
Operating Environment
Environmental Specification Operating Temperature: 0°C to 40°C (32°F to 104°F)
Non-Operating Temperature: -40°C to 70°C (-40°F to 158°F)
Operating Relative Humidity: 8% to 90% (Non-Condensing)
Non-Operating Relative Humidity: 5% to 95% (Non-Condensing)

How to Order

To place an order, please make an enquiry using the 'Request More Information' form at the bottom of the page and one of our experienced sales team will contact you shortly.

Alternatively, you can call or email us and speak to one of our experienced technical sales team. 

Tel: 01438 842 300
Email: sales@tmc-uk.com

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