Supermicro SYS-621BT-HNC8R BigTwin Multi-Node Server

High-Density BigTwin Multi-Node Infrastructure

The Supermicro SYS-621BT-HNC8R is a high-density 2U BigTwin multi-node server platform engineered for cloud computing, virtualisation, HPC, software-defined storage and enterprise data centre workloads. Designed with multiple hot-pluggable nodes in a compact shared infrastructure chassis, this platform delivers excellent compute density, rack efficiency and scalable performance for modern cloud and enterprise deployments.

BigTwin Architecture

Multi-node 2U design maximises compute density, rack efficiency and serviceability for cloud and enterprise infrastructure.

High-Density Compute

Designed for scalable workloads requiring strong multi-node performance within a compact data centre footprint.

Enterprise NVMe Storage

Supports high-speed NVMe storage configurations for cloud platforms, software-defined storage and data-intensive workloads.

Cloud-Scale Efficiency

Shared chassis infrastructure helps optimise power, cooling and rack utilisation across multiple independent server nodes.

Ideal Applications

  • Cloud Computing Infrastructure
  • Enterprise Virtualisation
  • High Performance Computing (HPC)
  • Software-Defined Storage
  • Private Cloud Platforms
  • Hyperscale Data Centres
  • Hyperconverged Infrastructure
  • High-Density Compute Clusters

Platform Highlights

Architecture 2U BigTwin Multi-Node Platform
Processors Intel® Xeon® Scalable Processor Support
Storage NVMe Storage Support
Expansion PCIe 5.0 Expansion Capability
Deployment Cloud, HPC & Virtualisation
Form Factor 2U Rackmount Multi-Node Server

Built for Scalable Multi-Node Deployments

The SYS-621BT-HNC8R combines BigTwin density, enterprise reliability and efficient shared infrastructure to support organisations deploying scalable cloud, virtualisation and high-performance compute environments.

Price available upon request.

Product Specifications

Product SKUs
SYS-621BT-HNC8R BigTwin Multi-Node Server
Motherboard
Super X13DET-B
Processor (per Node)
CPU Dual Socket E (LGA-4677)
5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors
Supports Intel Xeon CPU Max Series with high bandwidth memory (HBM)
Core Count Up to 64C/128T; Up to 320MB Cache per CPU
Note Supports up to 205W TDP CPUs (Air Cooled)*
Supports up to 350W TDP CPUs (Liquid Cooled)

*Air Cooled CPUs with TDP over 125W only supported under specific conditions. Contact a Supermicro representative for details.
System Memory (per Node)
Memory Slot Count: 16 DIMM slots
Maximum Memory (1DPC): Up to 4TB 5600MT/s ECC DDR5 RDIMM
Memory Voltage 1.1V
On-Board Devices (per Node)
SAS SAS (12Gbps) via Broadcom® 3808; IT mode
Network Connectivity Via AIOM
Input / Output (per Node)
LAN 1 RJ45 1GbE Dedicated BMC LAN port
USB 2 USB 3.0 Gen2 Type-A ports (rear)
Video 1 VGA port
System BIOS
BIOS Type AMI 32MB Flash ROM
Management
Software SuperCloud Composer®
Supermicro Server Manager (SSM)
Supermicro Update Manager (SUM)
Supermicro SuperDoctor® 5 (SD5)
Super Diagnostics Offline (SDO)
Supermicro Thin-Agent Service (TAS)
SuperServer Automation Assistant (SAA) New!
Power Configurations ACPI/APM Power Management
Security
Hardware Trusted Platform Module (TPM) 2.0
Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Features Cryptographically Signed Firmware
Secure Boot
Secure Firmware Updates
Automatic Firmware Recovery
Supply Chain Security: Remote Attestation
Runtime BMC Protections
System Lockdown
PC Health Monitoring
CPU 8+4 Phase-switching voltage regulator
Monitors for CPU Cores, Chipset Voltages and Memory
Fan Fans with tachometer monitoring
Pulse Width Modulated (PWM) fan connectors
Status monitor for speed control
Temperature Monitoring for CPU and chassis environment
Chassis
Form Factor 2U Rackmount
Model CSE-827BQ2-R3K04P
Dimensions and Weight
Height 3.47" (88 mm)
Width 17.68" (449 mm)
Depth 30.5" (774 mm)
Package 9.76" (H) x 24.65" (W) x 45.28" (D)
Weight Gross Weight: 96.6 lbs (43.8 kg)
Net Weight: 66.1 lbs (30 kg)
Available Colour Black front & silver body
Front Panel
Buttons Power On/Off button
UID button
LED HDD activity LED
Network activity LEDs
Power status LED
Universal Information (UID) LED
Expansion Slots (per Node)
PCI-Express (PCIe) Configuration Default
2 PCIe 5.0 x16 LP slots
1 PCIe 5.0 x16 AIOM slot (OCP 3.0 compatible)
Drive Bays / Storage (per Node)
Drive Bays Configuration Default: Total 3 bays
2 front hot-swap 3.5" PCIe 5.0 NVMe/SAS drive bays
1 front hot-swap 3.5" PCIe 4.0 NVMe/SAS drive bay
M.2 2 M.2 PCIe 4.0 x4 NVMe slots (M-key 22110; VROC required for RAID)
System Cooling
Fans Up to 4x 14.9K RPM Heavy Duty 8cm fans
Air Shroud 4 Air Shrouds
Liquid Cooling Direct to Chip (D2C) Cold Plate (optional)
Power Supply
2x 3000W Redundant (1 + 1) Titanium Level (96%) power supplies
Dimension (W x H x L) 45 x 40 x 480 mm
Total Output Power For CQC only
Input 1400W: 100-127Vac
1400W: 100-127Vac / 50-60Hz
2880W: 200-207Vac
2880W: 200-207Vac / 50-60Hz
3000W: 240-240Vdc (for CQC only)
3000W: 208-240Vac
3000W: 208-240Vac / 50-60Hz
3000W: 240-240Vdc / 50-60Hz (for CQC only)
+12V Max: 116A / Min: 0A (100Vac-127Vac)
Max: 240A / Min: 0A (200Vac-207Vac)
Max: 250A / Min: 0A (208Vac-240Vac)
Max: 250A / Min: 0A (240Vdc-240Vdc) (for CQC only)
12V SB Max: 4.5A / Min: 0A
Output Type Backplanes (connector)
Operating Environment
ROHS RoHS Compliant
Environmental Specification Operating Temperature: 10°C to 35°C (50°F to 95°F)
Non-operating Temperature: -30°C to 60°C (-22°F to 140°F)
Operating Relative Humidity: 8% to 80% (non-condensing)
Non-operating Relative Humidity: 8% to 90% (non-condensing)
Environmental / Recycling
Recycle Return Server-End of Life Product

How to Order

To place an order, please make an enquiry using the 'Request More Information' form at the bottom of the page and one of our experienced sales team will contact you shortly.

Alternatively, you can call or email us and speak to one of our experienced technical sales team. 

Tel: 01438 842 300
Email: sales@tmc-uk.com

There are no downloads available.

 

Sign Up to Our Free Newsletter for Expert Information & News