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Supermicro SYS-822GS-NB3RT Blackwell GPU Platform

Enterprise AI Factory Infrastructure

The Supermicro SYS-822GS-NB3RT is a next-generation AI platform engineered for hyperscale AI training, enterprise AI factories and accelerated HPC environments. Built around NVIDIA HGX™ B300 architecture, this 8U GPU platform delivers exceptional GPU density, ultra-fast interconnect bandwidth and enterprise-grade scalability for modern AI infrastructure.

NVIDIA HGX B300 Platform

Supports advanced NVIDIA Blackwell HGX™ B300 GPU architecture with NVLink™ and NVSwitch™ technology for AI-scale workloads.

AI Factory Ready

Optimised for generative AI, LLM training, enterprise AI clusters and large-scale accelerated computing environments.

PCIe Gen5 Infrastructure

Enterprise PCIe 5.0 bandwidth supporting high-speed GPU communication, networking and NVMe storage expansion.

Hyperscale Deployment

Designed for cloud providers, enterprise AI infrastructure and high-density GPU deployments requiring maximum scalability.

Ideal Applications

  • Large Language Models (LLMs)
  • AI & Deep Learning Training
  • Generative AI Infrastructure
  • Enterprise AI Factories
  • Hyperscale GPU Clusters
  • Scientific Research & Simulation
  • High Performance Computing (HPC)
  • Advanced Data Analytics

Platform Highlights

Processors Dual Intel® Xeon® Processors
GPU Architecture NVIDIA HGX™ B300
GPU Density 8x NVIDIA Blackwell GPUs
Memory Up to 6TB DDR5 ECC Memory
Expansion PCIe 5.0 Expansion
Form Factor 8U Rackmount GPU Platform

Built for Next-Generation AI Workloads

The SYS-822GS-NB3RT is engineered for organisations deploying large-scale AI infrastructure where GPU density, accelerated performance and enterprise reliability are critical to modern AI operations.

Price available upon request.

Product Specifications

Product SKUs
SYS-822GS-NB3RT GPU SuperServer SYS-822GS-NB3RT
SYS-822GS-NB3RT-01-G2 Gold Series version with pre-configured components
Motherboard
Super X14DBG-LC
Processor
CPU Dual Socket E2 (LGA-4710)
Intel® Xeon® 6700-series processors with P-cores
Core Count Up to 86C/172T; Up to 336MB Cache per CPU
Note Supports up to 350W TDP CPUs (Air Cooled)
GPU
Max GPU Count 8 onboard GPUs
Supported GPU NVIDIA SXM: HGX B300 8-GPU (288GB)
GPU-GPU Interconnect NVIDIA® NVLink™ with NVSwitch™
System Memory
Memory Slot Count: 32 DIMM slots
Max Memory (1DPC): Up to 4TB 6400MT/s ECC DDR5 RDIMM
Max Memory (2DPC): Up to 8TB 5200MT/s ECC DDR5 RDIMM
Memory Voltage 1.1V
On-Board Devices
Network Connectivity View AOC Options
Input / Output
LAN 8 OSFP 800 GbE LAN ports (NVIDIA ConnectX®-8 SuperNIC)
2 RJ45 10 GbE LAN ports (Intel® X710)
USB 1 USB 3.0 Type-A port (Front)
1 USB 2.0 Type-A port (Front)
Video 1 VGA port
1 mini-DP port
System BIOS
BIOS Type AMI 64MB UEFI
Management
Software SuperCloud Composer®
Supermicro Server Manager (SSM)
Super Diagnostics Offline (SDO)
Supermicro Thin-Agent Service (TAS)
SuperServer Automation Assistant (SAA) New!
Power Configurations Power-on mode for AC power recovery
ACPI Power Management
Security
Hardware Trusted Platform Module (TPM) 2.0
Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Features Cryptographically Signed Firmware
Secure Boot
Secure Firmware Updates
Automatic Firmware Recovery
Supply Chain Security: Remote Attestation
Runtime BMC Protections
System Lockdown
PC Health Monitoring
CPU 8+4 Phase-switching voltage regulator
Monitors for CPU Cores, Chipset Voltages, Memory
FAN Fans with tachometer monitoring
Pulse Width Modulated (PWM) fan connectors
Status monitor for speed control
Temperature Monitoring for CPU and chassis environment
Thermal Control for fan connectors
Chassis
Form Factor 8U Rackmount
Model CSE-GP807TS-R000NP
Dimensions and Weight
Height 13.8" (356 mm)
Width 17.6" (449 mm)
Depth 37.4" (950 mm)
Package 26.38" (H) x 28.74" (W) x 50.39" (D)
Weight Gross Weight: 302 lbs (137 kg)
Net Weight: 263 lbs (119 kg)
Available Colour Silver
Front Panel
Buttons Power On/Off
UID
LED HDD activity
LAN1 activity
LAN2 activity
Power Fail
Power status
System information (overheat/UID)
Expansion Slots
PCI-Express (PCIe) Configuration Default
2 PCIe 5.0 x16 FHHL slots
Drive Bays / Storage
Drive Bays Configuration Default: Total 8 bays
8 front hot-swap E1.S NVMe drive bays
M.2 2 M.2 NVMe slots (M-key; RAID support via S3808N controller)
System Cooling
Fans Up to 12 heavy duty fans with optimal fan speed control
Power Supply
6x 6600W Redundant (3 + 3) Titanium Level (96%) power supplies
Dimension (WxHxL) 106.5 x 82.1 x 245.3 mm
Input 5900W: 200-207.9Vac / 50-60Hz
6000W: 208-219.9Vac / 50-60Hz
6300W: 220-229.9Vac / 50-60Hz
6500W: 230-238.9Vac / 50-60Hz
6600W: 239-240Vac / 50-60Hz
+12V Max: 130A / Min: 0A (200Vac-207.9Vac)
Max: 130A / Min: 0A (208Vac-219.9Vac)
Max: 130A / Min: 0A (220Vac-229.9Vac)
Max: 130A / Min: 0A (230Vac-238.9Vac)
Max: 130A / Min: 0A (239Vac-240Vac)
12V SB Max: 4A / Min: 0A
Output Type Backplanes (gold finger)
Certification Titanium Level94%+ Titanium Level
Operating Environment
Environmental Spec. Operating Temperature: 10°C to 35°C (50°F to 95°F)
Non-operating Temperature: -40°C to 60°C (-40°F to 140°F)
Operating Relative Humidity: 8% to 90% (non-condensing)
Non-operating Relative Humidity: 5% to 95% (non-condensing)

How to Order

To place an order, please make an enquiry using the 'Request More Information' form at the bottom of the page and one of our experienced sales team will contact you shortly.

Alternatively, you can call or email us and speak to one of our experienced technical sales team. 

Tel: 01438 842 300
Email: sales@tmc-uk.com

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