1. Up to 2TB 3DS ECC RDIMM, DDR4-2666MHz; Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots
2. Intel® Xeon® Processor Scalable Family, Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s
3. Intel® C621 Chipset
4. Up to 3TB 3DS ECC RDIMM, DDR4-2666MHz; Up to 3TB 3DS ECC LRDIMM, in 24 DIMM slots
5. 2 PCI-E 3.0 x16 + 8 PCI-E 3.0 x8 or 4 PCI-E 3.0 x16 + 4 PCI-E 3.0 x8 and 1 PCI-E 3.0 x4 (in x8 slot)
6. 1 M.2 PCI-E 3.0 x4 Form Factor: 2280/22110
7. VGA D-sub connector, TPM header
8. 10 ports SATA3 (2 iPass (8 ports) + 2 SuperDOM)
9. Dual 10GBase-T LAN with Intel® X550
10. Integrated IPMI 2.0 and KVM with Dedicated LAN