Key Features:
- 3D Rendering
- Astrophysics, Chemistry
- Cloud and Virtualization needs
- Cloud Computing
- Compute Intensive Application
- Dual Root System for balanced performance & higher CPU to GPU communication
1. Dual Socket P (LGA 3647) support 2nd Gen. Intel® Xeon® Scalable processors (Cascade Lake/Skylake)
2. 24 DIMMs; up to 6TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPM
3. 8 PCI-E 3.0 x16 slots, (support up to 8 double width GPU), 2 PCI-E 3.0 x8, 1 PCI-E 3.0 x4
4. Up to 24 Hot-swap 2.5" drive bays; 8x 2.5" SATA drives supported 8x 2.5" SATA drives supported drives supported with included H/W, 1 NVMe based M.2 SSD
5. 2x 10GBase-T LAN ports via Intel C622
6. 8 Hot-swap 92mm RPM cooling fans
7. 2000W (2+2) Redundant Power Supplies, Titanium Level (96%+)